Industry 4.0 – Integrating Innovation for the New Smart World – Satven sponsors & participates in the NASSCOM Engineering Summit 2015
Posted by Admin, Thursday, October 8, 2015
The Digital Revolution is now all pervasive and its penetration into all types of businesses is progressing at a rapid pace. The Manufacturing Industry has also jumped into the race and begun embracing digital technologies to transform the industry with the Smart Factory concept.
While it was the industrial revolution that ultimately led to the rise of the technology industry, what the world is witnessing now is a reversal – Digital Technology is leading to a new kind of industrial revolution – Industry 4.0.
Industry 4.0 vision is to marry the Industrial Revolution with the Digital Revolution to transform the way businesses are done going forward. Enterprises are increasingly looking to leveraging the global Innovation capacities available to enable the Industry 4.0 vision.
The 7th NASSCOM Engineering Summit was held against this backdrop to demonstrate India’s thought leadership and readiness to take on these emerging opportunities.
Satven was a Silver Sponsor at this prestigious Engineering Summit, held on the 7th & 8th October 2015 at Hotel Westin, Pune. Satven had also set up a stall to showcase its engineering capabilities and the solutions offered by it to the global Auto Industry.
Sridhar Lakshminarayanan, Global Delivery Head for CAE, Satven, was a panelist in the discussion titled “Extracting the creativity through collaborative innovation for Smart Manufacturing”. Sridhar’s talk was titled “Manufacturing Smart Materials for Light-Weighting: A Future Automotive Challenge”. He spoke at length on why light-weighting is the order of the day in today’s automotive industry, methods to reduce vehicle weight, the driving parameters of smart manufacturing, trends in material composition and evolution of traditional materials, novel sandwich structures, smart structures with smart materials, current & future challenges, and the way forward. He also dwelled upon some of the challenges one would encounter while representing smart materials & joining methods in the virtual CAE world.
